- 当前位置:
- 首页
- >
- 元器件详细参数
- >
- ZSSC3154BA1D代理商/详细参数
ZSSC3154BA1D
图片仅供参考, 请参阅产品规格
ZSSC3154BA1D
- DICE (WAFER SAWN) - WAFFLE PACK
- IDT, Integrated Device Technology Inc
- ZSSC3154BA1D代理商/分销商
购买、咨询产品请提交询价信息
推荐的产品
- ZSSC3154BA1B
- 品牌:IDT, Integrated Device Technology Inc
- 描述:WAFER (UNSAWN) - BOX
- ZSSC313XBOARDV1P2S
- 品牌:IDT, Integrated Device Technology Inc
- 描述:SSC BOARD ZSSC313X V1.2 WITH SAM
- ZSSC313XBOARDV1P1S
- 品牌:IDT, Integrated Device Technology Inc
- 描述:SSC BOARD ZSSC313X V1.1 WITH SAM
- ZSSC3138BE1D
- 品牌:IDT, Integrated Device Technology Inc
- 描述:DICE (WAFER SAWN) - WAFFLE PACK
- ZSSC3138BE1C
- 品牌:IDT, Integrated Device Technology Inc
- 描述:DICE (WAFER SAWN) - FRAME
- ZSSC3138BE1B
- 品牌:IDT, Integrated Device Technology Inc
- 描述:WAFER (UNSAWN) - BOX
- ZSSC3138BA1D
- 品牌:IDT, Integrated Device Technology Inc
- 描述:DICE (WAFER SAWN) - WAFFLE PACK
- ZSSC3138BA1B
- 品牌:IDT, Integrated Device Technology Inc
- 描述:WAFER (UNSAWN) - BOX
- ZSSC3136BE1D
- 品牌:IDT, Integrated Device Technology Inc
- 描述:DICE (WAFER SAWN) - WAFFLE PACK
- ZSSC3136BE1C
- 品牌:IDT, Integrated Device Technology Inc
- 描述:DICE (WAFER SAWN) - FRAME
ZSSC3154BA1D参数信息
参数 | 参数值 |
Series
|
*
|
Package
|
Tray
|
Type
|
-
|
Input Type
|
-
|
Output Type
|
-
|
Current - Supply
|
-
|
Operating Temperature
|
-
|
Mounting Type
|
-
|
Package / Case
|
-
|
Supplier Device Package
|
-
|
天天IC网为您提供了由IDT, Integrated Device Technology Inc生产的ZSSC3154BA1D的详细信息及分销商代理商信息,您可以联系他们通过原厂、代理商等渠道进行代购。这里有ZSSC3154BA1D参数信息、推荐的产品和ZSSC3154BA1D数据手册可供查阅。ZSSC3154BA1D功能描述为:DICE (WAFER SAWN) - WAFFLE PACK,你可以查阅ZSSC3154BA1D中文资料、引脚图、Datasheet数据手册功能说明书等资料,资料中有详细的引脚图及功能的应用电路图电压和使用方法及教程。